ASTM B 30-1993 铜基合金锭

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【英文标准名称】:Copper-BaseAlloysinIngotForm
【原文标准名称】:铜基合金锭
【标准号】:ASTMB30-1993
【标准状态】:作废
【国别】:美国
【发布日期】:1993
【实施或试行日期】:
【发布单位】:美国材料与试验协会(ASTM)
【起草单位】:ASTM
【标准类型】:()
【标准水平】:()
【中文主题词】:合金;有色金属;有色金属;铜合金;铜;铸锭;压模铸造
【英文主题词】:copper;alloys;diecasting;copperalloys;non-ferrousmetals;ingots;nonferrousmetals
【摘要】:
【中国标准分类号】:H62
【国际标准分类号】:77_120_30
【页数】:8P;A4
【正文语种】:英语


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Product Code:SAE J551/15
Title:Vehicle Electromagnetic Immunity--Electrostatic Discharge (Esd)
Issuing Committee:Electromagnetic Compatibility (Emc) Standards
Scope: This SAE Standard specifies the ESD test methods and procedures necessary to evaluate electronic modules intended for vehicle use. It describes test procedures for evaluating electronic modules on the bench as well as for evaluating complete vehicles. A procedure for calibrating the simulator that is used to generate the electrostatic discharges is given. Functional status classifications for immunity to ESD are given.

MIL-HDBK-1547, DEPARTMENT OF DEFENSE HANDBOOK: ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE AND LAUNCH VEHICLES (09 NOV 1997) [SUPERSEDING MIL-STD-1547]., This Handbook was developed to aid Designers and Parts, Materials, and Processes (PMP) specialists with the design, development, and fabrication of electronic systems required to have long life and/or high reliability while operating under extreme conditions/ environments of Space and Launch Vehicles. The purpose of this handbook is to establish and maintain consistent and uniform methods for development of technical requirements for electronic parts, materials, and processes used in the design, development, and fabrication of space and launch vehicles. It provides a common basis for estimating of Application Information, Design and Construction Considerations, and Quality Assurance Provisions for the proposed Design Application. It also establishes a common basis for comparing and evaluating of industry practices for related or competitive designs. This handbook is intended to be used as a tool to increase the performance and reliability of the system under design.